Failure Investigation, RCA & Forensics

Failure investigation is a vital tool for feeding back information to improve asset operational performance. Failure Investigation is the process of understanding the key attributes of a particular failure and identifying the likely causes of failure. A formal method for assessing failures is a Root Cause Analysis (RCA). An RCA is the process of conducting an analysis to identify the physical, human, and latent causes of a particular undesirable event. Root causes can be: specific underlying causes, those that can reasonably be identified, and those that are controllable and fixable and those where prevention is possible.

Most operators have formal processes for failure investigation and RCA, where important findings are fed back into the system to improve future integrity and reliability.

Dexotech has extensive experience with a large number of multi disciplinary failure investigations and we draw on the comprehensive power background to perform the analysis.   We are Kepner Tregoe certified and tailor a unique approach for each investigation. 

Our services

  • Forensic engineering.
  • Root Cause Analysis (RCA).
  • Expert witness testimony for insurance, accident investigation and product liability.
  • Perform Third Party review of failure data such as
    • Failure photos.
    • Failure incident reports.
    • Technical failure communication.
    • Relevant service history.
    • Operating conditions.
    • Design, commissioning, and maintenance review.
    • System operation review such as harmonic and transient events, loading, fault or switching circumstance.
    • Equipment technical specification review.
  • Microscopic inspection of samples and high quality. photography.
  • Radiography, Xray/CT scan.
  • Accurate dimensional inspections.
  • Performance of electrical testing on samples such as Partial Discharge and dielectric measurements.
  • Material Testing:
    • Shear force.
    • Tensile strength.
    • Hardness test.
    • Compression strength Fourier Transform Infrared (FTIR).
    • Thermomechanical analysis (TMA).
    • Thermogravimetric analysis (TGA).
    • Inductively Coupled Plasma analysis (ICP).